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Metallized Ceramic
US$1.00-10.00 / Piece
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What is High Precision Small-Size Aluminum Oxide Alumina Metallized Ceramic Al2O3 Tubes

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Application Electronic Devices, Lighting, Power Supply, Semiconductors
  • Conductive Layer Thick Copper Layer
  • Material Alumina
  • Process Mo-Mn Metallized
  • Thickness Customized
  • Transport Package Carton, Wooden Box, Pallet
  • Specification Customized
  • Trademark WINTRUSTEK
  • Origin Fujian, China
  • Material Options for Amb Si3n4, Aln
  • Surface Roughness < Ra1.5
  • Warpage < 0.5%
  • Copper Purity >99.99%

Product Description

Product Description Metallized Ceramics: Metallized ceramics are ceramics coated with a layer of metal, allowing them to be firmly bonded to metal components. This process typically involves depositing a metal layer on the ceramic surface, followed by high-temperature sintering to bond the ceramic ...

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Metallized Ceramic Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$10.00-100.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 10 Pieces
Payment Terms LC, T/T, PayPal, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union, Money Gram, by cash
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: Alumina;
Process: Mo-Mn Metallized;
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Electronic Devices, Semiconductors, Refractory, Industrial Ceramics;
Conductive Layer: Thick Film Resistor;
Material: Al2O3;
Process: Direct Bonded Copper;
Thickness: 0.25 mm;
Pressing Speed: Punch Forming;
Suppression Method: Unidirectional Pressurization;
Name: Thick Film Circuit;
Shape: Irregular Shape;
Advantage: High Temperature and Chemical Corrosion;
Working Temperature: 1400-1800c;
Usage: Industry Usage;
Size: Customers' Requests;
Grain Size: 1-10um;
Purity: 95%;
Type: Ceramic Part;
Supplier Name

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Shanghai Yunnuo Industrial Co., Ltd.

Diamond Member Audited Supplier

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