| Specification |
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: 95 Corundum;
Cell Shape: Hexagon, Cell Shape Is Customizable;
Cell Number: 40 Cell; Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: 85 Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: 95 Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 13X13 Cell;Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina Cordierite Mullite Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 13X13 Cell;Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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