| Specification |
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
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Application: Aerospace, Electronics, Medical, Chemical, Automotive, IoT;
Shape: Standard / Customized;
Forming Process: Dry Pressing;
Product Type: Sensor Ceramics;
Suitable for: Capacitive Pressure Sensors;
Product Features: Good Density, High Precision, Good Stability;
Type: Ceramic Part;
Purity: 95% / 99% / 99.5%;
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Application: Aerospace, Electronics, Medical, Chemical, Automotive, IoT;
Shape: Standard / Customized;
Forming Process: Dry Pressing;
Product Type: Sensor Ceramics;
Suitable for: Capacitive Pressure Sensors;
Product Features: Good Density, High Precision, Good Stability;
Type: Ceramic Part;
Purity: 95% / 99% / 99.5%;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Purity: 96% / 99.6% Alumina;
Density: Over 3.70g/cm3;
Forming Method: Tape Casting;
Optional Color: White, Ivory, Pink, Black;
Standard Thickness: 0.25-2.0mm Available;
Thickness Tolerance: 0.03mm/0.05mm (Depending on Thickness);
Length and Width Tolerance: ±2mm;
Features: High Electrical Insulation, Small Dielectric Loss;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Zro2;
Forming Method: Tape Casting;
Features: High Flexural Strength and Wear Resistance;
Usage: Blank Ceramic Circuit Board;
Optional Color: White, Yellow, Black, Blue;
Density: Over 6.0g/cm3;
Dielectric Constant: 33MHz;
Dielectric Loss Angle: ≤16MHz;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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