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Amb Ceramic Substrate
US$1.00-10.00 / Piece
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What is Custom Amb Ceramic Aln Si3n4 Copper Bonded High Thermal Conductivity Base Substrate for IGBT Power Module EV Inverter System

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Application Electronic Devices, Power Supply, Semiconductors
  • Conductive Layer Customizable
  • Material Al2O3
  • Process Customizable
  • Thickness Customizable
  • Transport Package Wooden Box
  • Specification Customizable
  • Trademark OEM/ODM
  • Origin China
  • Density 3.7g/Cm3
  • Warp ≤200um
  • Wetability ≥95%
  • Flexural Strength ≥330/350/700MPa
  • Thermal Conductivity 23W /M·K
  • Dielectric Constant 9 MHz
  • Dielectric Strength ≥20kv/mm
  • Hole Diameter 120~ 160um
  • Hole Spacing ≥0.2mm
  • Positioning Accuracy ±150um
  • Hole to Metal Edge Distance ≥0mm
  • Hole to Tile Edge Distance ≥1mm
  • Main Ingredients Cu AG Ti

Product Description

Product Description Thick-film Substrates on Ceramic Surfaces Ceramic surface metallization is a process that creates a uniform metal coating on a ceramic substrate. Its primary purpose is to enhance the ceramic material's properties, including electrical conductivity, mechanical strength, and ...

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Amb Ceramic Substrate Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$5.00-50.00 / Piece US$20.00-25.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece
Min Order 1 Piece 1 Piece 10 Pieces 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T, PayPal, Small-amount payment LC, T/T, PayPal, Small-amount payment LC, T/T, PayPal, Small-amount payment LC, T/T, PayPal, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Aerospace, Electronics, Medical, Refractory;
Material: AlN;
Density: 3.28-3.30 g/cm3;
Color: Grey, Black;
Thermal Conductivity: 160-230 W/M.K;
Max Working Temperature (in Air): 800 C;
Max Working Temperature (in Vacuum): 1200 C;
Max Working Temperature (in Inert Gas): 1500 C;
Dielectric Strength: 15 Kv/mm;
Type: Ceramic Plate;
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: BeO;
Process: Direct Bonded Copper;
Thickness: 0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm;
Density: 2.85 g/cm3;
Color: White;
Flexural Strength: 190 MPa;
Thermal Conductivity: >260 W/M.K;
Dielectric Strength: >20 Kv/mm;
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: Alumina;
Process: Mo-Mn Metallized;
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: Alumina;
Process: Mo-Mn Metallized;
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
Supplier Name

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

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