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Ceramic Circuit Board
US$1.00-10.00 / Piece
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What is High Thermal Conductivity Ceramic Circuit Board for Power Module Amb Ceramic Board with Copper Brazed Structure

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Application Electronic Devices, Power Supply, Semiconductors
  • Conductive Layer Customizable
  • Material Al2O3
  • Process Customizable
  • Thickness Customizable
  • Transport Package Wooden Box
  • Specification Customizable
  • Trademark OEM/ODM
  • Origin China
  • Density 3.7g/Cm3
  • Warp ≤200um
  • Wetability ≥95%
  • Flexural Strength ≥330/350/700MPa
  • Thermal Conductivity 23W /M·K
  • Dielectric Constant 9 MHz
  • Dielectric Strength ≥20kv/mm
  • Hole Diameter 120~ 160um
  • Hole Spacing ≥0.2mm
  • Positioning Accuracy ±150um
  • Hole to Metal Edge Distance ≥0mm
  • Hole to Tile Edge Distance ≥1mm
  • Main Ingredients Cu AG Ti

Product Description

Product Description Thick-film Substrates on Ceramic Surfaces Ceramic surface metallization is a process that creates a uniform metal coating on a ceramic substrate. Its primary purpose is to enhance the ceramic material's properties, including electrical conductivity, mechanical strength, and ...

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Ceramic Circuit Board Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$1.00-3.00 / Piece US$0.80-3.00 / Piece US$0.30-1.00 / Piece US$10.00-15.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 100 Pieces 10 Pieces
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Industrial Ceramic;
Material: Aluminum Nitride Ceramic;
Name: Aluminum Nitride Ceramic Substrate;
Size: Customized;
Shape: Customized;
Appearance: Neat;
Surface: Polished;
Property: Thermal Insulation;
Advantage: Long Working Life;
Usage: Electronic Products;
Feature: High Temperature Resistant;
Surface Roughness: Ra 0.2-0.6um;
Thermal Conductivity: >170W;
Flexural Strength(MPa): 382.7;
Dielectric Strength: 15 Kv/mm Min;
Application: Industrial Ceramic;
Material: Aluminum Nitride Ceramic;
Name: Aluminum Nitride Ceramic Substrate;
Size: Customized;
Shape: Customized;
Appearance: Neat;
Surface: Polished;
Property: Thermal Insulation;
Advantage: Long Working Life;
Usage: Electronic Products;
Feature: High Temperature Resistant;
Surface Roughness: Ra 0.2-0.6um;
Thermal Conductivity: >170W;
Dielectric Strength: 15 Kv/mm Min;
Key Word: Aluminum Nitride Ceramic Substrate;
Application: Industrial Ceramic;
Material: Alumina Ceramic;
Thickness: 1mm;
Name: Alumina Ceramic Substrate;
Colour: White;
Size: Customized;
Appearance: Neat;
Surface: Polished;
Property: Insulating;
Advantage: Long Working Life;
MOQ: 10;
Density: 3.56-3.9g/cm3;
Feature: Wear Resistance;
Usage: Hpsl;
Key Word: Alumina Ceramic Sheet;
Purity: 96% Alumina Ceramic;
Type: Ceramic Plates;
Application: Refractory, Structure Ceramic, Industrial Ceramic;
Material: Aluminum Nitride;
Thickness: 0.1, 0.2, 0.25, 0.38, 0.635, 1mm;
Usage: Ceramics Parts;
Color: Grey;
Size: Customized;
Thermal Conductivity: More Than 170W/Mk;
Density: >3.60;
Width*Length: 2, 3, 4, 4.5, 7.5 Inch;
Drawing: Yes;
Key Wods: Aln Ceramic Gasket;
Key Words1: Ceramic Sheet;
Type: Ceramic Parts;
Supplier Name

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Lianyungang Highborn Technology Co., Ltd.

Diamond Member Audited Supplier

Lianyungang Highborn Technology Co., Ltd.

Diamond Member Audited Supplier

Lianyungang Highborn Technology Co., Ltd.

Diamond Member Audited Supplier

Lianyungang Highborn Technology Co., Ltd.

Diamond Member Audited Supplier

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