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Amplifier Clone PCB
US$0.01 / Piece
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What is Amplifier Smart Electronics Clone PCB Inverter Competitive Price One-Stop Procurement Capacitor PCBA Door Alarm Computer Assy Marker

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

  • Metal Coating Enig / HASL / OSP / Silver etc.
  • Mode of Production SMT / DIP / Customized
  • Layers From 2 Layers to 50 Layers
  • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package UPS/DHL/TNT/EMS/FedEx
  • Specification Custom
  • Trademark OEM
  • Origin China
  • Solder Mask Color Green,Blue,Yellow,White,Black,Red
  • Special Process Buried Hole, Blind Hole, Partial High Density, Bac
  • Copper Thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz
  • Layer Count 1-50 Layers
  • Quality Standard Ipc Class 2 and Ipc Class 3

Product Description

Overview Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) ...

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Amplifier Clone PCB Comparison
Transaction Info
Price US$0.01 / Piece US$0.01-10.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece US$0.01-150.00 / Piece
Min Order 1 Piece 1 Piece 10 Pieces 10 Pieces 1 Piece
Payment Terms T/T, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO, UL RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO, UL
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America North America North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - ODM, OEM ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min Packing: 0204;
Min Distance Among BGA: 0.25-2.0mm;
Min BGA Size: 0.1-0.63mm;
Placement Capability: 0805, 0603, 0402;
Supplier Name

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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