| Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Size: Customization;
Copper Thickness: 0.5-6 Oz;
Service: PCB&PCBA One-Stop Turnkey Service;
PCBA: PCBA Manufacturer Custom Service;
Layer: 1-60 Layers;
Testing Service: 100%;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Board Thickness: 0.3 mm- 4 mm;
Surface Finishing: OSP, Lead Free HASL, Enig, Immersion Tin, Gold PLA;
Impedance Control: Support;
PCBA Assembly: Welcome, SMT and DIP Soldering;
Customize: Avaliable;
MOQ: 1PCS;
Best Price: Please Contact Us;
Delivery Time: Sample Is Available Within 3days;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Orange Pi 3b;
Model Number: Single Board Computer;
Chipest: Rockchip Rk3566;
CPU: Quad-Core 64-Bit Cortex-A55 Processor, 22nm Advanc;
Pmu: Rk809-5;
RAM: 2GB/4GB/8GB (Lpddr4/4X);
Memory: Spi Flash: 16MB/32MB or Emmc Module;
Wi-Fi+Bt: Wi-Fi 5+Bt 5.0,BLE(Ap6256);
Ethernet: 10/100/1000Mbps Ethernet (on-Board Phy Chip: Yt853;
Power Source: Type-C 5V3a;
PCB: 56*89mm;
Weight: 52g;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 8 L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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