| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: BeO;
Process: Au Plating;
Thickness: Customized;
Material Options for Amb: Beo, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
|
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Industrial Ceramic, Power Electronics Industries;
Conductive Layer: Thin Wire Dielectric Layer;
Material: BeO;
Process: High-Temperature Co-fired Ceramic;
Thickness: 0.25-5mm;
Product Name: Beryllia Ceramic Substrate;
Processing Service: Moulding, Punching, Cutting, DEC;
Usage: Electronic Technology;
Keyword: High Temperature Beryllium Oxide Ceramic;
Type: Beryllium Oxide Plate;
Size: Customized;
Density: 2.85g/cm3;
Dielectric Strength: ≥15 Kv/mm;
Bending Strength: ≥170 MPa;
Thermal Conductivity: 160-240 W/M°K;
Feature: High Thermal Conductivity;
Advantage: Low Dielectric Constant;
|
Application: Ceramic Decorations, Refractory, Structure Ceramic;
Material: Zirconia Ceramic;
Process: High-Temperature Co-fired Ceramic;
Color: Customized;
Density: 6.0g/cm3;
Zirconia Content: 94.4%;
Unit: Piece;
Weight: Customized;
OEM/ODM: Available;
Gas Permeability: 0;
Water Absorption: 0;
Crystal Size: 0.5um;
Lead Time: 10 Days;
Type: Ceramic Parts;
|
Application: Industrial Ceramic;
Material: Alumina Ceramic;
Soften Temperature: >1360;
Cpsi: 300, 400, 500, 600cpsi;
MOQ: 100PCS;
Standrad: Euro3, 4, 5, 6;
Coating Service: Yes;
Thermal Stability ( 550celsius ): >3times;
Type: Honeycomb Ceramic;
|
Application: Industrial Ceramic;
Material: Alumina Ceramic;
Soften Temperature: >1360;
Cpsi: 300, 400, 500, 600cpsi;
MOQ: 100PCS;
Standrad: Euro3, 4, 5, 6;
Coating Service: Yes;
Thermal Stability ( 550celsius ): >3times;
Type: Honeycomb Ceramic;
|