| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: Alumina;
Process: Metallized;
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Shape: Hexagonal Cell;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Shape: Hexagonal Cell;
Cell Number: 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
|
Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Cell Shape: Hexagonal Cell;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Shape: Square Cell;
Cell Number: 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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