| Specification |
Application: Aerospace, Electronics, Medical, Refractory;
Material: AlN;
Density: 3.28-3.30 g/cm3;
Color: Grey, Black;
Thermal Conductivity: 160-230 W/M.K;
Max Working Temperature (in Air): 800 C;
Max Working Temperature (in Vacuum): 1200 C;
Max Working Temperature (in Inert Gas): 1500 C;
Dielectric Strength: 15 Kv/mm;
Type: Ceramic Plate;
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Application: Aerospace, Amb Substrate;
Compressive Strength: 2300MPa;
Coating Thickness: 8-30μm;
Coating Layer: Copper;
Plated Layer: Nickel/Copper/Gold;
Thermal Conductivity: 25W/(M.K);
Plating Thickness: 2-9μm;
Max. Use Temperature: 1600℃;
Density: 3.7g/cm3;
Type: Insulating Ceramics;
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Application: Aerospace, Electronics, Medical, Refractory;
Conductive Layer: Thick Copper Layer;
Material: Al2O3;
Process: Direct Bonded Copper;
Thickness: Customized;
Vickers Hardness: 11;
Dielectric Loss: 9;
Shape: Plate;
Max Use Temperature: 1400°C;
Color: White;
Hardness: 11.5;
Thermal Conductivity: 24.7;
Processing Service: Moulding, Active Metal Bonding;
Density: 3.6-3.7;
Flexural Strength: 300MPa;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Ceramic Plates;
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Application: Aerospace, Electronics, Medical, Refractory;
Conductive Layer: Thick Copper Layer;
Material: Al2O3;
Process: Direct Bonded Copper;
Thickness: Customized;
Vickers Hardness: 11;
Dielectric Loss: 9;
Shape: Plate;
Max Use Temperature: 1400°C;
Color: White;
Hardness: 11.5;
Thermal Conductivity: 24.7;
Processing Service: Moulding, Active Metal Bonding;
Density: 3.6-3.7;
Flexural Strength: 300MPa;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Ceramic Plates;
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Application: Aerospace, Electronics, Medical, Refractory;
Technology: Dbc/ Dpc;
Size: Customized Size;
Processing Service: Cutting, Punching, Moulding;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Ceramic Plates;
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