| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Industry;
Conductive Layer: Thick Copper Layer;
Material: AlN;
Process: Customizable;
Thickness: Customizable;
Colour: Gray;
Density: ≥3.33G/Cm³;
Dielectric Constant: 8~10MHz;
Dielectric Strength: ≥17 Kv/mm;
Flexural Strength: ≥450 MPa;
Water Absorption: 0%;
Volume Resistivity: ≥1013 ω.Cm;
Key Word: Aluminum Nitride Ceramic;
Key Words: Aln Ceramic;
Keyword: Alumina Nitride Ceramic Part;
Keywords: Aln Ceramic Part;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Type: Ceramic Substrate;
Substrate Material: 96%, 99.6% Alumina;
Surface Metallization Process: Silver Firing;
Usage: to Realize Electrical Connections;
Adhesion: Excellent;
Solderability: Excellent;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Corundum Mullite;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Zirconia Corundum;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Zro2;
Forming Method: Tape Casting;
Density: Over 5.95g/cm3;
Feature: Ultra-Smooth Surface;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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