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What is Customized Amb Metallized Ceramic Substrate with Active Metal Brazing Copper Layer for High Power Devices
Price
Min. Order Reference FOB Price
1 Piece US$1.00-15.00 / Piece
Sepcifications
- Application Electronic Devices, Power Supply, Semiconductors
- Conductive Layer Customizable
- Material AlN
- Process Customizable
- Thickness Customizable
- Transport Package Wooden Box
- Specification Customizable
- Trademark OEM/ODM
- Origin China
- Density 3.3G/Cm3
- Warpage ≤200um
- Solder Wettability ≥95%
- Flexural Strength ≥350MPa
- Thermal Conductivity ≥170W/M K
- Coefficient of Thermal Expansion 4.7(20~ 300℃)10-6/K
- Dielectric Loss 0.0005MHz
- Dielectric Constant 9MHz
- Dielectric Strength ≥20kv/mm
- Resistivity 10^14ω.Cm
- Aperture 120-160μm
- Aperture Pitch ≥0.2mm
- Au Layer Thickness 0.01-0.2 μm
- Ni Layer Thickness 2-10 μm
- AG Layer Thickness 0.03-1.0 μm
Product Description
Product Description Aluminum Nitride Ceramic AMB Copper-Clad Substrate Its high thermal conductivity of 160 to 180 W/m·K makes it ideal for heat dissipation applications. Its coefficient of thermal expansion is well matched to silicon, making it useful in electronic packaging and semiconductor ...
