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SMT Machine
US$30,000.00-35,000.00 / Piece
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What is Magic Ray Double-Sided Aoi-V5300 Dual-Side PCB Inspection Machine for Wave Solder & CPU Pin Detection

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$30,000.00-35,000.00 / Piece

Sepcifications

  • Type Double-Sided Simultaneous Automatic Optical Inspec
  • Inspection Technology Double-Sided 2D Aoi Dual-Camera Visual Inspection
  • Resolution High-Precision Industrial Resolution
  • Lighting System Upper & Lower Independent Multi-Angle LED Illumin
  • Weight Capacity 50 Kg
  • Magnification 0.8X -12X Adjustable
  • Application PCBA Double-Sided Inspection, Wave Solder Line, Cp
  • Transport Package Export Standard Plywood Case with Shockproof Foam
  • Trademark Magic Ray
  • Origin China
  • Imaging Mode Double-Sided Simultaneous Automatic Optical Inspec
  • Pallet Mode Optional Turntable Pallet (High Temperature & Heav
  • Positioning Algorithm Pad Positioning + Fov Positioning + Feature Point
  • Special Function CPU Pin Dedicated Defect Detection Algorithm

Product Description

The Magic Ray Double-Sided AOI-V5300 is a leader in simultaneous double-sided PCBA inspection. It can inspect both top and bottom surfaces of the PCB in one pass, replacing two single-sided machines to simplify production flow and greatly save workshop space. It adopts dual-camera synchronous ...

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SMT Machine Comparison
Transaction Info
Price US$30,000.00-35,000.00 / Piece US$20,000.00-30,000.00 / Piece US$50,000.00-60,000.00 / Piece US$60,000.00-70,000.00 / Piece US$29,990.00-35,000.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Double-Sided Simultaneous Automatic Optical Inspec;
Inspection Technology: Double-Sided 2D Aoi Dual-Camera Visual Inspection;
Resolution: High-Precision Industrial Resolution;
Lighting System: Upper & Lower Independent Multi-Angle LED Illumin;
Weight Capacity: 50 Kg;
Magnification: 0.8X -12X Adjustable;
Application: PCBA Double-Sided Inspection, Wave Solder Line, Cp;
Imaging Mode: Double-Sided Simultaneous Automatic Optical Inspec;
Pallet Mode: Optional Turntable Pallet (High Temperature & Heav;
Positioning Algorithm: Pad Positioning + Fov Positioning + Feature Point;
Special Function: CPU Pin Dedicated Defect Detection Algorithm;
Type: Fully Automatic Online 3D Axi Inspection Machine;
Inspection Technology: 3D Visual Scanning, Multi-Modal Data Fusion, Ai in;
Resolution: High-Definition Industrial 3D Scanning Resolution;
Lighting System: Intelligent Partition Adaptive Dimming LED Lighti;
Weight Capacity: Not Applicable;
Magnification: Auto-Focus Adaptive Magnification (Adjustable Acc;
Application: Industrial 3D Dimensional Measurement, Surface Def;
Core Technology: Integrated 3D Dimensional Measurement & Surface De;
Performance Features: High-Speed, High-Precision, Full-Coverage Non-Dead;
Algorithm Support: Multi-Modal Data Fusion & Intelligent Ai Defect Re;
Display & Output: Multi-View Real-Time Rendering & 3D Model One-Clic;
Type: High-Power 3D X-ray Non-Destructive Testing (Axi);
Inspection Technology: High-Power 3D Axi Non-Destructive Testing, Microfo;
Resolution: Multi-Level High-Definition Industrial Image Resol;
Lighting System: High-Power Microfocus X-ray Projection System (160;
Weight Capacity: 50 Kg;
Magnification: 2X - 30X Adjustable High-Precision Optical Magnifi;
Application: Overweight & Ultra-High Workpiece NDT, Automotive;
X-ray Source: Optional 160kv / 180kv Microfocus X-ray Source;
Inspection Speed: Max 1.7 Seconds Per Fov (Ultra-High-Speed Flying S;
Core Technology: Multi-Layer Positioning Detection (Anti-Metal Inte;
Flexible Configuration: Multiple Image Resolutions & Projection Counts Ad;
Type: Fully Automatic Online 3D Axi Inspection Machine;
Inspection Technology: 3D Axi Inspection, Ultra-High-Speed Flying Shootin;
Resolution: 7 Levels Adjustable High-Definition Industrial Res;
Lighting System: Circular Multi-Angle Projection Light Source Syste;
Weight Capacity: 30 Kg;
Magnification: 3X - 25X Adjustable High-Precision Optical Magnifi;
Application: Fully Automatic Online 3D Defect Inspection, SMT;
Core Technology: Ultra-High-Speed Flying Shooting & Circular Multi;
Inspection Speed: Max 1.7 Seconds Per Fov;
Flexible Configuration: 7 Projection Counts & 7 Resolutions Adjustable;
Programming Function: 3 Compatible Programming Modes & One-Click Paramet;
Type: 3D Online Solder Paste Inspection Machine;
Inspection Technology: White Light Sine Stripe PMP 3D Imaging Technology;
Resolution: ≤0.37μm;
Magnification: 20X~100X;
Application: Automotive Electronics;
Camera Resolution: 5 Megapixels High Definition Industrial Camera;
Height Inspection Accuracy: Height ≤1μm (4 Sigma); Area/Volume ≤1% (4 Sigma);
Min Detectable Component: 0402 Imperial Chip Components;
Max PCB Size: 50×60mm ~ 460×460mm;
PCB Thickness Range: 0.6mm ~ 6mm;
Supplier Name

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

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