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SMT Machine
US$20,000.00-30,000.00 / Piece
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What is Magic Ray Magicscan? 3D Camera High-Speed High-Precision Integrated Vision Sensor for Dimensional Measurement & Surface Defect Detection

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-30,000.00 / Piece

Sepcifications

  • Type Fully Automatic Online 3D Axi Inspection Machine
  • Inspection Technology 3D Visual Scanning, Multi-Modal Data Fusion, Ai in
  • Resolution High-Definition Industrial 3D Scanning Resolution
  • Lighting System Intelligent Partition Adaptive Dimming LED Lighti
  • Weight Capacity Not Applicable
  • Magnification Auto-Focus Adaptive Magnification (Adjustable Acc
  • Application Industrial 3D Dimensional Measurement, Surface Def
  • Transport Package Export Standard Plywood Case with Shockproof Foam
  • Trademark Magic-Ray
  • Origin China
  • Core Technology Integrated 3D Dimensional Measurement & Surface De
  • Performance Features High-Speed, High-Precision, Full-Coverage Non-Dead
  • Algorithm Support Multi-Modal Data Fusion & Intelligent Ai Defect Re
  • Display & Output Multi-View Real-Time Rendering & 3D Model One-Clic

Product Description

The Magic Ray MagicScan™ 3D Camera is an all-in-one intelligent vision solution that integrates high-precision 3D dimensional measurement and comprehensive surface defect detection, designed to solve the dual demands of size inspection and defect identification in modern industrial ...

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SMT Machine Comparison
Transaction Info
Price US$20,000.00-30,000.00 / Piece US$30,000.00-35,000.00 / Piece US$30,000.00-35,000.00 / Piece US$30,000.00-35,000.00 / Piece US$30,000.00-35,000.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Fully Automatic Online 3D Axi Inspection Machine;
Inspection Technology: 3D Visual Scanning, Multi-Modal Data Fusion, Ai in;
Resolution: High-Definition Industrial 3D Scanning Resolution;
Lighting System: Intelligent Partition Adaptive Dimming LED Lighti;
Weight Capacity: Not Applicable;
Magnification: Auto-Focus Adaptive Magnification (Adjustable Acc;
Application: Industrial 3D Dimensional Measurement, Surface Def;
Core Technology: Integrated 3D Dimensional Measurement & Surface De;
Performance Features: High-Speed, High-Precision, Full-Coverage Non-Dead;
Algorithm Support: Multi-Modal Data Fusion & Intelligent Ai Defect Re;
Display & Output: Multi-View Real-Time Rendering & 3D Model One-Clic;
Type: Magic Ray Downward Vision Aoi-V5200;
Inspection Technology: Downward Vision 2D Aoi, Visual Algorithm Inspectio;
Resolution: High-Precision Industrial Resolution;
Lighting System: Multi-Angle LED Cold Light Illumination;
Weight Capacity: 50 Kg;
Magnification: 0.8X -12X Adjustable;
Application: Post Wave Solder Inspection, SMT/DIP PCBA, CPU Pin;
Algorithm System: Multi-Algorithm Fusion for SMT, Wave Solder, Speci;
Programming: Ai-Assisted One-Click Programming, Automatic Pola;
Transmission Mode: Belt or Turntable Transmission Optional;
Application Scenario: Pre-Reflow & Post-Eflow Inspection;
Type: 2D Automatic Optical Inspection (Aoi) Machine;
Inspection Technology: 2D Visual Automatic Optical Inspection, Ai-Assiste;
Resolution: 5μm High-Definition Industrial Resolution;
Lighting System: Multi-Angle LED Cold Light Illumination (Standard;
Weight Capacity: 25kg;
Magnification: 0.8X-8X Adjustable (Actual Lens Range);
Application: SMT PCB Assembly, Solder Joint Defect Inspection,;
Programming System: Magic Ray Exclusive Ai-Powered Automatic Programm;
Mechanical Structure: Magic Ray Exclusive Ai-Powered Automatic Programmi;
Imaging Configuration: Industrial High-Definition Telecentric Lens;
Main Inspection Scope: SMT PCB Solder Joints, Component Defects, Offset &;
Type: Double-Sided Simultaneous Automatic Optical Inspec;
Inspection Technology: Upward-Vision 2D Aoi, Ai Visual Algorithm Inspecti;
Resolution: High-Precision Industrial Resolution;
Lighting System: Multi-Angle LED Cold Light Illumination;
Weight Capacity: 50 Kg;
Magnification: 0.8X -12X Adjustable;
Application: Post Wave Solder Inspection, SMT/DIP PCBA, CPU Pin;
Imaging Mode: Downward Vision Automatic Optical Inspection;
Transmission Structure: Turntable Transmission (Heavy Load & High Temperat;
Programming Mode: Ultra-Simple One-Click Pin Window Generation;
Special Function: Automatic Board Bending Compensation, Fiber Sensor;
Type: Packaged IC Final Inspection & 3D Measurement Sys;
Inspection Technology: 3D Metrology, Advanced Visual Inspection, Automati;
Resolution: High-Definition Industrial Sub-Micron Resolution;
Lighting System: Multi-Angle LED & Coaxial Illumination System (Opt;
Weight Capacity: 10 Kg;
Magnification: 2X - 20X Adjustable Optical Magnification;
Application: Semiconductor Packaging IC Final Inspection, 3D Me;
Equipment Type: Packaged IC Final Inspection & 3D Measurement Sys;
Core Technology: High-Precision 3D Metrology & Advanced Visual Insp;
Inspection Object: Finished Packaged Semiconductor Ics (Various Pack;
Imaging Resolution: High-Definition Industrial Resolution for Sub-Micr;
Supplier Name

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

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