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Automatic IC Programming Machine
US$16,000.00-20,000.00 / Set
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What is Ruibo Automatic Tape/Tube IC Programming Machine with Burning Systems for Chip Company

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-4 Sets US$20,000.00

5+ Sets US$16,000.00

Sepcifications

  • After-sales Service Remote Coaching or on-Site Service
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO, CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Box
  • Specification 900mm*100mm
  • Trademark RBZDH
  • Origin Dongguan, Guangdong, China
  • PC Control Use a USB Link, Suppert Offline Burning
  • Holder Dedicated Bounce Buring
  • Buring Efficiency 3600/Burning Time(Sec +3)*2
  • Input Power 220VAC 1# 3.0kw
  • Working Gas Source 0.4-0.6MPa
  • Drive Mode of Tape Torque Motor Drive
  • Drive Mode of IC SMC Rodless Cylinder Drive
  • Detectuve Product Automatic Alarm
  • Extemal Control Interface RS 232
  • Edit Mode PC + Hand Control Box
  • X/Y Moving Range 400*400mm
  • Moving Accuracy +/-0.02mm
  • Conversational Style Touchscreen
  • Gas Source 4~8kg/Cm2
  • Control System PLC

Product Description

Product Parameters Model CB-AU 910 Drive system 1. XYZ precision screw rod, precision modulus, servo synchronous structure. 2. The Z axis can be lifted and lowered independently, with angle rotation function. 3. Reinforced and weighted one-piece chassis, 800mm/S movement without shaking, ...

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Automatic IC Programming Machine Comparison
Transaction Info
Price US$16,000.00-20,000.00 / Set US$50,000.00-90,000.00 / Piece US$10,000.00-100,000.00 / Piece US$70,000.00-120,000.00 / Piece US$100,000.00-1,000,000.00 / Piece
Min Order 1 Set 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms - LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO, CE ISO ISO, CE RoHS, ISO, CE -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Europe Europe Europe Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Product Attributes
Specification
After-sales Service: Remote Coaching or on-Site Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
PC Control: Use a USB Link, Suppert Offline Burning;
Holder: Dedicated Bounce Buring;
Buring Efficiency: 3600/Burning Time(Sec +3)*2;
Input Power: 220VAC 1# 3.0kw;
Working Gas Source: 0.4-0.6MPa;
Drive Mode of Tape: Torque Motor Drive;
Drive Mode of IC: SMC Rodless Cylinder Drive;
Detectuve Product: Automatic Alarm;
Extemal Control Interface: RS 232;
Edit Mode: PC + Hand Control Box;
X/Y Moving Range: 400*400mm;
Moving Accuracy: +/-0.02mm;
Conversational Style: Touchscreen;
Gas Source: 4~8kg/Cm2;
Control System: PLC;
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Key Applications: Power Devices, Advanced Packaging;
Placement Accuracy: 50um;
Throughput: Pplication-Dependent;
Dispensing: Dual-System;
Theta Accuracy: ±1° @3σ;
Force & Process Control: Stable Force Control;
Model Type: Da801/Da1201;
Dual Dispensing Options: Dipping (Epoxy) Jetting (Non-Contact);
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Accuracy: +/-50um@3σ;
Theta Accuracy: ±3° @3σ;
Throughput: up to 20 Clips/Cycle;
Bonding Functions: Prebond & Postbond;
Inspection Capabilities: Solder Patch & Paste Inspection;
Drive System: High-Precision Linear Die Bond Head;
Material Handling: Clip Punching System;
Application: Power Semiconductor Packaging;
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: COB Smart Die Bonding Machine;
High Placement Accuracy: +/- 50um @3σ;
Theta Placement Accuracy: +/- 3° @3σ;
High Throughput: up to 20 Clips / Cycle;
Automation Level: Fully Automatic Loading & Unloading;
Target Products: SMD, 1W & High-Power COB Surface Light Sources;
Pin Processing Capability: Ultra-Long Pin (65ms);
Minimum Chip Size: 5 Mil (127 Micrometers);
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Supplier Name

Dongguan Ruibo Automation Equipment Co., Ltd.

Diamond Member Audited Supplier

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

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