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Precision Bonder
US$10,000.00-100,000.00 / Piece
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What is Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$10,000.00-100,000.00 / Piece

Sepcifications

  • After-sales Service Yes
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO, CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Air Freight
  • Specification customized
  • Trademark Himalaya
  • Origin China
  • Placement Accuracy +/-50um@3σ
  • Theta Accuracy ±3° @3σ
  • Throughput up to 20 Clips/Cycle
  • Bonding Functions Prebond & Postbond
  • Inspection Capabilities Solder Patch & Paste Inspection
  • Drive System High-Precision Linear Die Bond Head
  • Material Handling Clip Punching System
  • Application Power Semiconductor Packaging

Product Description

Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or Wooden Box Packaging Trademark Himalaya Production Capacity 1 Automatic loading ...

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Precision Bonder Comparison
Transaction Info
Price US$10,000.00-100,000.00 / Piece US$3,888.00-6,888.00 / Set US$3,888.00-6,888.00 / Set US$3,888.00-6,888.00 / Set US$75,000.00-85,000.00 / Piece
Min Order 1 Piece 1 Set 1 Set 1 Set 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T T/T T/T T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification ISO, CE CCC, PSE, FDA, RoHS, ISO, CE CCC, PSE, FDA, RoHS, ISO, CE CCC, PSE, FDA, RoHS, ISO, CE -
Management System Certification - - - - -
Trade Capacity
Export Markets Europe Europe, Domestic, South Asia Europe, Domestic, South Asia Europe, Domestic, South Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM -
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Accuracy: +/-50um@3σ;
Theta Accuracy: ±3° @3σ;
Throughput: up to 20 Clips/Cycle;
Bonding Functions: Prebond & Postbond;
Inspection Capabilities: Solder Patch & Paste Inspection;
Drive System: High-Precision Linear Die Bond Head;
Material Handling: Clip Punching System;
Application: Power Semiconductor Packaging;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: SMT Placement Machine;
Inventory: Availability;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: SMT Placement Machine;
Inventory: Availability;
After-sales Service: Video Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: SMT Placement Machine;
Inventory: Availability;
After-sales Service: Pick and Place Machine;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Spindle & Speed: 2 Gantry * 10 Spindle / 78, 000 Cph;
Component Range: 0402 ~ 14mm(H 12mm);
Dimension: 1650×1690×1458;
Applicable Parts: 0402 ~ 42mm(H 15mm);
Applicable PCB: Max. 510(L) X 460(W)(Standard) Max. 610(L) X 460(W;
Lead Time: in Stock 2-3days;
Alignment: Fly Camera;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

Diamond Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

Diamond Member Audited Supplier

Guangdong Xinling Industrial Co., Ltd

Diamond Member Audited Supplier

MERAIF LIMITED

Gold Member Audited Supplier

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