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Polymide Circuit
US$0.38 / Piece
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What is Multi-Layer PCB FPC Polymide Flexible Printed Circuit for Membrane Keypad Switch

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$0.38 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Door Lock
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Etching
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Snt
  • Transport Package Carton
  • Specification Customized
  • Trademark SNT
  • Origin China
  • Size Customizable
  • Thickness 0.08-0.32mm
  • Tensile Strength ≥200 MPa
  • Working Temp. -269℃~+250℃
  • Feature 1 Chemical Resistance
  • Feature 2 Oil-Resistant

Product Description

FPC Specification (Customized option) Number of Layers Single Sided, Double Sided, Multilayer,Rigid-flex PCB Based Material PI, PET Custom Made: OEM/customize Flexible layers 1~4layer Minimum Trace and Space 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm Minimum Space between Coverlay ...

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Polymide Circuit Comparison
Transaction Info
Price US$0.38 / Piece US$0.32-0.52 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$2.89 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Product Certification - - ISO9001,ISO14001,ISO13485,Ts-16949,etc ISO9001,ISO14001,ISO13485,Ts-16949,etc -
Management System Certification ISO9001:2015, ISO14001 - ISO14001, Others ISO14001, Others -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model ODM, OEM - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Door Lock;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Etching;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt;
Size: Customizable;
Thickness: 0.08-0.32mm;
Tensile Strength: ≥200 MPa;
Working Temp.: -269℃~+250℃;
Feature 1: Chemical Resistance;
Feature 2: Oil-Resistant;
Structure: FPC;
Material: Polyester Film;
Combination Mode: Without Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Fastline;
Board Material: Polyimide;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Yellow;
Silk Screen: White;
PCB Type: Flexible PCB;
Test: 100%Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Supplier Name

SNT Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

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