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Copper Flex Circuits
US$0.50 / Piece
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What is PCB+FPC Bonding Flexibale Printed Circuits for Modern Electronics

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$0.50 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Customized
  • Transport Package Carton
  • Specification Customized
  • Trademark SNT
  • Origin China
  • Function Durable, Waterproof, Dustproof, UV Resistant
  • Logo/Design Customized
  • Dimension/Shape OEM Service
  • Color Pantone, Ral, Cmyk

Product Description

FPC Specification (Customized option) Number of Layers Single Sided, Double Sided, Multilayer,Rigid-flex PCB Based Material PI, PET Custom Made: OEM/customize Flexible layers 1~4layer Minimum Trace and Space 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm Minimum Space between Coverlay ...

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Copper Flex Circuits Comparison
Transaction Info
Price US$0.50 / Piece US$0.10-0.50 / Piece US$0.10-0.50 / Piece US$0.10-0.50 / Piece US$0.50-5.00 / pieces
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 5 pieces
Payment Terms T/T LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification ISO9001:2015, ISO14001 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand Own Brand Own Brand Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Supplier Name

SNT Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

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