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Flexible Printed Circuits
US$0.38 / Piece
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What is High Precision Pi Base Rigid FPC Rigid Flexible Printed Circuits

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$0.38 / Piece

Sepcifications

  • Structure Double-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Display Bonding
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Etching
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Snt
  • Transport Package Carton
  • Specification Customized
  • Trademark SNT
  • Origin China
  • Size Customizable
  • Thickness 0.08-0.32mm
  • Tensile Strength ≥200 MPa
  • Working Temp. -269℃~+250℃
  • Feature Chemical Resistance

Product Description

FPC Specification (Customized option) Number of Layers Single Sided, Double Sided, Multilayer,Rigid-flex PCB Based Material PI, PET Custom Made: OEM/customize Flexible layers 1~4layer Minimum Trace and Space 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm Minimum Space between Coverlay ...

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Flexible Printed Circuits Comparison
Transaction Info
Price US$0.38 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB
Quality Control
Product Certification - ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS
Management System Certification ISO9001:2015, ISO14001 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Display Bonding;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Etching;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt;
Size: Customizable;
Thickness: 0.08-0.32mm;
Tensile Strength: ≥200 MPa;
Working Temp.: -269℃~+250℃;
Feature: Chemical Resistance;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Comple;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Supplier Name

SNT Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

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