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Development Board
US$51.99-53.99 / Piece
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What is Rockchip Rk3568 Quad Core Ai IoT Arm Embedded Industrial Open Source Motherboard Android and Linux Systems

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$51.99-53.99 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Rockchip
  • Maximum Memory Capacity 8G
  • Structure ATX
  • Memory DDR2
  • SATA Interface SATA3.0
  • CPU Socket LGA 775
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
  • Specification Customized
  • Trademark customized
  • Origin Shenzhen, China
  • Name PCBA Assembly Manufacturing
  • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
  • Advantages PCB Design/Assembly, PCBA & EMS
  • Good Services SMT, BGA and DIP
  • Production Type SMT & DIP & Assembling & Testing
  • Certificate UL94V-0+RoHS
  • Services OEM&ODM Manufacturer Since 2005
  • Item Control Board PCBA

Product Description

Product Description Rockchip RK3568 Development Board Core Board Rongpin for Industrial Computer System CPU Rockchip RK3568,ARM 4Core A55,Up to 2.0GHz GPU Mali-G52 2EE NPU Support 0.8Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB ...

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Development Board Comparison
Transaction Info
Price US$51.99-53.99 / Piece US$143.00-149.00 / Piece US$111.00-117.00 / Piece US$289.00 / Piece US$223.00 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification UL94V-0+RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR2;
SATA Interface: SATA3.0;
CPU Socket: LGA 775;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR4;
SATA Interface: SATA;
CPU Socket: LGA 1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Chipset Manufacture: Intel;
Memory Bank: 2 DDR4 DIMM;
Socket Type: Fcbga1356;
Hard Drive Interface: SATA, Msata;
Fsb / Ht: 2.0GHz~2.42GHz.;
Form Factor: 3.5-Inch;
Products Status: New, Stock;
Maximum RAM Capacity: Maximum RAM Capacity;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR3;
SATA Interface: SATA;
CPU Socket: LGA 1156;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Chipset Manufacture: Intel;
CPU: I3/I5/I7 Processors;
Chipset: Haswell-U,Broadwell-U Express Chipset;
Operating System: Win7 Win8.1 Win10 Linux;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z-3.5inch Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: 6th Gen Mobile Skylake-U CPU;
USB: 2*USB3.0 6*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Additional: 2*Mini-Pcie;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z-3.5inch Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: 6th Gen Mobile Skylake-U CPU;
USB: 2*USB3.0 6*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Additional: 2*Mini-Pcie;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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