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Android Development Board
US$64.90-69.90 / Piece
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What is Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Pieces US$64.90-69.90 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Rockchip
  • Maximum Memory Capacity 8G
  • Structure ATX
  • Memory DDR2
  • SATA Interface SATA3.0
  • CPU Socket LGA 775
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
  • Specification Customized
  • Trademark customized
  • Origin Shenzhen, China
  • Name PCBA Assembly Manufacturing
  • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
  • Advantages PCB Design/Assembly, PCBA & EMS
  • Good Services SMT, BGA and DIP
  • Production Type SMT & DIP & Assembling & Testing
  • Certificate UL94V-0+RoHS
  • Services OEM&ODM Manufacturer Since 2005
  • Item Control Board PCBA

Product Description

Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860 RAM With Standard 2GB/4GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

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Android Development Board Comparison
Transaction Info
Price US$64.90-69.90 / Piece US$178.00-185.00 / Piece US$62.00-65.00 / Piece US$58.00-65.00 / Piece US$122.00-130.00 / Piece
Min Order 2 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification UL94V-0+RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR2;
SATA Interface: SATA3.0;
CPU Socket: LGA 775;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA;
CPU Socket: Slot 1;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 4G;
Structure: Mini-ITX;
Memory: 1*DDR3;
SATA Interface: SATA3.0;
CPU Socket: Socket AM2/AM2+;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Warranty: 1year;
Condition: 100% Test;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Use: Commercial, Educational, Industrial, Game, Home;
Network: In_Tel I 225-Lm Gigabit Network Card Chip;
Hard Disk: 1*Msata;1*SATA1;1*SATA_Pwr Pin;
USB: 2*USB3.0;4*USB2.0;1*F_USB1;1*F_USB1 Pin;
Switch: 1*F_Panel Pin;1*Auto_Sw Pin;
Operating System: Win 10, Win 11, Linux, etc.;
BIOS: Ami BIOS, Support Power-on, Scheduled Power-on;
Watch Dog: Watchdog Programming, Hardware Reset Function;
Working Temperature: -10℃~60℃;
Working Humidity: 5%~95% Relative Humidity, No Condensation;
Display: 1*VGA;1*HD_Mi;1*Lvds;1*Invert Pin;
Power Supply: 1*DC_in or 1*ATX (4pin);
Sound Function: 1*Line_out;1*Mic_in;1*Int_Spk Pin;
Chipset: Haswell-U, Broadwell-U High- Speed Chipset;
Other I/O: 6*COM;Jpcom1/2;SIM Card;Clr_CMOS;CPU_Fan;J_Gpio;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

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