| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Solder Mask Color: Green, Red, Black (as Your Require);
Silkscreen Color: White, Black;
Testing Service: Ict, Function Test, X-ray, Aoi;
Layers: 1-64;
MOQ: 5PCS;
Warranty: 2 Years;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4tg;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Copper Thickness: 10z;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Supplier Type: Manufacturer;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4tg;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Copper Thickness: 10z;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Supplier Type: Manufacturer;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
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Type: Rigid Circuit Board;
Dielectric: SIC;
Material: Fiberglass Epoxy;
Application: Gold Plating / Hot Air Solder Leveling;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Vacon;
Service: Technical Support;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
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