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Multilayer PCB
US$0.89-1.35 / pieces
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What is Smart Electronics Advanced SMT/DIP/BGA Soldering Process for PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$1.35

100+ pieces US$0.89

Sepcifications

  • Type Smart Electronics PCBA
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4tg
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong, China
  • Selling Units Single Item
  • Copper Thickness 10z
  • Min.Hole Size 0.1mm
  • Solder Mask Green, Red, Blue, Yellow, Black, White etc
  • Min.Line Spacing 0.075mm
  • Supplier Type Manufacturer
  • Min.Line Width 0.15mm
  • Board Thickness 0.2-4.0mm
  • Surface Finishing HASL, Lead Free

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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Multilayer PCB Comparison
Transaction Info
Price US$0.89-1.35 / pieces US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 5 pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4tg;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Copper Thickness: 10z;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Supplier Type: Manufacturer;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

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