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Honeycomb Ceramic Substrate
US$1,300.00-1,560.00 / Cubic Meters
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What is Corundum 25 Cell 40 Cell 43 Cell 50 Cell 60 Cell Honeycomb Ceramic Substrate

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Cubic Meters US$1,560.00

10-19 Cubic Meters US$1,495.00

20-39 Cubic Meters US$1,430.00

40-99 Cubic Meters US$1,365.00

100+ Cubic Meters US$1,300.00

Sepcifications

  • Application Refractory, Industrial Ceramic, Rto/Rco & Heat Storage
  • Material Corundum
  • Transport Package Wooden Pallet
  • Specification 150*150*300, Specifications are customizable
  • Trademark Kexing
  • Origin Pingxiang, Jiangxi, China
  • Cell Shape Square, Cell Shape Is Customizable
  • Cell Number Cell Number and Size Are Customizable
  • Groove Plate, Single, Double, Cross, Four Footer, Chute
  • Type Honeycomb Ceramic Thermal Storage Media

Product Description

> Honeycomb Ceramics The HTAC technology (High Temperature Air Combustion) is a huge energy-saving and environmental efficacy of new combustion technology and it is also considered as a reliable, industry proven combustion method allowing emissions reduction, combustion process improvement, ...

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Honeycomb Ceramic Substrate Comparison
Transaction Info
Price US$1,300.00-1,560.00 / Cubic Meters US$1.00-30.00 / Piece US$1.00-15.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece
Min Order 1 Cubic Meters 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, PayPal, Small-amount payment LC, T/T, PayPal, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: AlN;
Process: Customizable;
Thickness: Customizable;
Density: 3.3G/Cm³;
Warpage: ≤200um;
Solder Wettability: ≥95%;
Flexural Strength: ≥350MPa;
Thermal Conductivity: ≥170W/M K;
Coefficient of Thermal Expansion: 4.7(20~ 300℃)10-6/K;
Dielectric Loss: 0.0005MHz;
Dielectric Constant: 9MHz;
Dielectric Strength: ≥20kv/mm;
Resistivity: 10^14ω.Cm;
Aperture: 120-160μm;
Aperture Pitch: ≥0.2mm;
Au Layer Thickness: 0.01-0.2 μm;
Ni Layer Thickness: 2-10 μm;
AG Layer Thickness: 0.03-1.0 μm;
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: AlN;
Process: Active Metal Brazing (Amb);
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: AlN;
Process: Active Metal Brazing (Amb);
Thickness: Customized;
Material Options for Amb: Si3n4, Aln;
Surface Roughness: < Ra1.5;
Warpage: < 0.5%;
Copper Purity: >99.99%;
Supplier Name

Jiangxi Kexing Special Ceramic Co., Ltd.

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

Xiamen Wintrustek Advanced Materials Co., Ltd.

Diamond Member Audited Supplier

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