| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Materials: Fr4, Cem-3, FPC, Alu;
Layer: 1-32;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCB Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Process: SMT&DIP&Pth&BGA Assembly;
MOQ: 1PCS;
Copper Thickness: 18um-210um(6oz);
Test: X-ray, Aoi, Ict, Functional Test;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
Special Process: RoHS/Lead Free Compliance, Conformal Coating;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
Component Packing: Tary, Tube, Tape;
Certificates: ISO9001, ISO14001, IATF16949, ISO13485;
Service: PCB Prototype, Bom Kitting, Electronic Components;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 2 Oz;
Board Layer: 1-20 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green/Custom;
Legend: White;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.0mm;
Copper Thickness: 2oz;
Surface Finish: Immersion Gold/Customized;
Solder Mask: Blue;
Legend: White/Customized;
Layer: Multi-Layer;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 1-20 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green/Custom;
Legend: White;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 1-24;
Material Finished Thickness: 1.6mm;
Base Material Type: Fr-4 (Tg110-180),Aluminum Based, Rogers,Shenyi...;
Surface Treatment: Immersion Gold;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Special: Impedance Control, Buried-Blind Vias Holes...;
Lead Time: 5 Working Days;
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