| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Fr;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape: Rectangular, Round, Slots, Cutouts, COM;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch* 22inch or 550mm* 550mm;
Min.Drilled Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 1/20z, 10z, 20z, 30z;
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Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No Brand;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds PRO 16;
Machine No. 6: Hds-7 Carbon;
Machine No. 7: Hds-9 Carbon;
Machine No. 8: Hds-12 Carbon;
Machine No. 9: Hds-16 Carbon;
Machine No. 10: Hds 9 Gen 2 Touch;
Machine No. 11: Hds 9 Gen 3 Touch;
Machine No. 12: Hds 12 Gen 2 Touch;
Machine No. 13: Hds 12 Gen 3 Touch;
Machine No. 14: Hds 8 Insight USA;
Machine No. 15: Hds-8;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-40 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
Minimum Line/Space: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
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Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
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