| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Layer: 4 Layer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
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Type: Combining Rigid Circuit Board;
Dielectric: Non-Woven Glass Reinforced PTFE;
Material: Non-Woven Glass Reinforced PTFE;
Application: Conformal Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Non-Woven Glass Reinforced PTFE;
Insulation Materials: Non-Woven Glass Reinforced PTFE;
Brand: Rogers;
Test Method: Ipc TM-650;
Board Types: Rigid PCB;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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