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PCB
US$0.01-10.00 / Piece
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What is Wholesale Multilayer HDI PCB Board Customized PCB & PCBA Motherboard PCB Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-10.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS Report
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-8oz
  • Surface Finish/Treatment HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Product Description

Wholesale Multilayer HDI PCB Board Customized PCB &PCBA Motherboard PCB Assembly Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline ...

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PCB Comparison
Transaction Info
Price US$0.01-10.00 / Piece US$110.00-130.00 / Square Meter US$110.00-130.00 / Square Meter US$110.00-130.00 / Square Meter US$1.28-1.88 / Piece
Min Order 1 Piece 2 Square Meters 2 Square Meters 2 Square Meters 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T LC, T/T LC, T/T LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS Report - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr-4;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 8;
Surface: Enig;
Thickness: 1.2mm;
Vias: 0.15mm;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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