| Specification |
Structure: Single-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tkm;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
|
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt-Technology;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Yellow;
Solder Resists: Coverlay;
|
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt-Technology;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Yellow;
Solder Resists: Coverlay;
|
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Brand: N/a;
Thickness: 0.15mm;
Cu: 35um/35um;
Surface: Enig;
Solder Mask: Yellow;
Stiffener: No;
|
Structure: Multilayer FPC;
Material: Pen Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pen Film;
Insulation Materials: Epoxy/Silicon Resin;
Brand: Hjh;
Pen Film Thickness: 25um, 50um, 75um, 100um, 125um, Others;
Copper Thickness (Edhd/Ra): 18um, 35um, 70um, Others;
Copper Side: Single / Double;
Adhesive: with / Without;
Roll Width: 500mm, 250mm, Others;
Roll Length: 100m;
Flammability: UL94V0;
|
