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Polyimide Flex PCB Circuit Board/ FPCB Supplier Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Brand N/a
  • Transport Package Vacuum Packaging
  • Specification ISO9001& ISO14001& SGS& UL
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Made in China
  • Thickness 0.15mm
  • Cu 35um/35um
  • Surface Enig
  • Solder Mask Yellow
  • Stiffener No

Product Description

Polyimide Flex PCB Circuit Board/ FPCB Supplier 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. Printed ...

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PCB Board Comparison
Transaction Info
Price US$0.01-150.00 / Piece US$0.04 / Piece US$6.00-25.00 / kg US$0.014 / Piece US$15.00-35.00 / Piece
Min Order 1 Piece 100 Pieces 50 kg 100 Pieces 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T LC, PayPal, Western Union, Money Gram T/T -
Quality Control
Product Certification - - ISO9001 - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Brand: N/a;
Thickness: 0.15mm;
Cu: 35um/35um;
Surface: Enig;
Solder Mask: Yellow;
Stiffener: No;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Double-Sided FPC;
Material: Fiberglass;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ry;
Type: Insulation Film;
Chemistry: Organic Insulation;
Classification: Organic Insulating Material;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Emerson;
Item Name: 3051 PA Bus Display and Circuit Board;
Warranty: 1 Year;
MOQ: 1PC;
Place of Origin: China, Singapore, Germany;
Customized Support: OEM, ODM;
Brand Name: Emerson;
Model Number: 3051;
Support Protocol: Hart, Fondation Field Bus;
Measuring Range: -50~300℃ Optional;
Voltage Supply: 24(V);
Max Rate: 115kbs;
Single Gross Weight: 1.000 Kg;
Selling Units: Single Item;
Single Package Size: 5*5*5 Cm;
Industry: Petrochemical Industry;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

Gold Member Audited Supplier

Xuchang Rainyan Insulation Material Co., Ltd.

Gold Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

Gold Member Audited Supplier

Kerui (Weifang) Automation Equipment Co., Ltd.

Diamond Member Audited Supplier

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