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Shenzhen FPC Supplier Rigid-Flex Printed Circuit Board Manufacturing PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.45

1,000-4,999 Pieces US$0.32

5,000+ Pieces US$0.26

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V2
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Transport Package Vacuum Packing
  • Specification Rohs, UL
  • Trademark Fastline
  • Origin Shenzhen
  • Layer 2
  • Solder Mask Green + Yellow Cover Film
  • Board Thickess 1.6mm Rigid and 0.1mm Flex
  • Copper Thickness 1oz
  • Silk Screen White
  • Test 100%
  • Small Order Accepter
  • Board Material Fr4+ Polymide
  • PCB Type Rigd-Flex PCB
  • Product Type Customized
  • Supply Fast
  • Min Hole 0.1mm
  • Min Trace 3mil/3mil
  • MOQ 1PCS
  • Service One-Stop
  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Processing Technology Electrolytic Foil
  • Base Material Polyimide & Fr4
  • Brand Fastline

Product Description

Multilayer Electronic Rigid-Flexible PCB Supplier Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single side ...

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Rigid Flex PCB Comparison
Transaction Info
Price US$0.26-0.45 / Piece US$0.01-100.00 / piece US$0.10-100.00 / piece US$0.10-100.00 / piece US$0.10-0.50 / piece
Min Order 1 Piece 1 piece 1 piece 1 piece 1 piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V2;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
Supply: Fast;
Min Hole: 0.1mm;
Min Trace: 3mil/3mil;
MOQ: 1PCS;
Service: One-Stop;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Brand: Fastline;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Communication;
Copper: 35um;
Rigid Board Thickness: 1.2mm;
Flex Board Thickness: 0.2mm;
Rigid Board Layers: 4;
Flex Board Layers: 2;
Surface Finish: Enig;
Solder Mask: Green;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Board Thickness: 0.1+1.6mm;
Material Sheet: Polyimide+Fr4;
Surface Finish: Enig;
Copper Thickness: 35um;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Communication;
Structure: Multilayer FPC;
Material: Polyimide,Fr4;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Surface Finish: Enig;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen, LED;
Structure: Double Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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