| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen, LED;
Structure: Double Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
|
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V2;
Application: Aerospace;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
|
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V2;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
Supply: Fast;
Min Hole: 0.1mm;
Min Trace: 3mil/3mil;
MOQ: 1PCS;
Service: One-Stop;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Brand: Fastline;
|
Insulation Materials: Metal Composite Materials;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Thicknes: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 10 Workdays;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V2;
Application: Medical Instruments;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
Dielectric: Fr-4;
|
