| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: AlN;
Type: Ceramic Substrate;
Surface Metallization Process: Silver Firing;
Usage: to Realize Electrical Connections;
Adhesion: Excellent;
Solderability: Excellent;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 50X50 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina Cordierite Mullite Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 50X50 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina Cordierite Mullite Corundum;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 50X50 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 50X50 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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