| Specification |
Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 50X50 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Shape: Long Strip, or as Required;
Standard Thickness: 0.25-2mm;
Feature: High Mechanical Strength, Electrical Insulation;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Si3n4;
Thickness: Customized;
Feature: Extremely High Mechanical Strength and Fracture to;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Forming Method: Tape Casting;
Color: White, Ivory, Pink, Black;
Min. Thickness: 0.10mm;
Max. Thickness: 30mm;
Feature: Excellent Electrical Insulation;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Finished Product: Ceramic Circuit Board;
Substrate Material: 96%, 99.6% Alumina;
Surface Metallization Process: Mo-Mn Metallization and Ni Plating;
Feature: Strong Bonding Strength Between Ceramic and Metal;
Usage: to Realize Electrical Connections;
Type: Ceramic Substrate;
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