| Specification |
Application: Electronic Devices, Semiconductors;
Material: Al2O3;
Thickness: Customized;
Color: White;
Density: ≥3.70g/cm3;
Max. Service Temperature: 1200ºC;
Young's Modulus: 340 Gpa;
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Application: Aerospace, Electronics, Medical, Refractory;
Conductive Layer: Thick Copper Layer;
Material: Al2O3;
Process: Direct Bonded Copper;
Thickness: Customized;
Vickers Hardness: 11;
Dielectric Loss: 9;
Shape: Plate;
Max Use Temperature: 1400°C;
Color: White;
Hardness: 11.5;
Thermal Conductivity: 24.7;
Processing Service: Moulding, Active Metal Bonding;
Density: 3.6-3.7;
Flexural Strength: 300MPa;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Ceramic Plates;
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Application: Aerospace, Electronics, Medical, Refractory;
Compressive Strength: 550-3000MPa;
Volume Resistivity: >10 14;
Flexural Strength: 345-380MPa;
Max Using Temperature: 1500-1700;
Color: White/Ivory;
Ceramic Thermal Conductivity: 16.7-35W/M.K;
Vickers Hardness: 11-14gpa;
Water Absorption: 0;
Density: 3.6-3.95g/cm3;
Purity: 95%;
Type: Insulating Ceramics;
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Application: Aerospace, Electronics, Industrial Ceramic;
Color: White;
Compressive Strength: 2100-2500MPa;
Working Temperature: 1700 Degree;
Processing Service: Punching, Decoiling, Moulding;
Density: 3.8GM/Cc;
Feature: Heat Resistance;
Flexural Strength: 280-350 MPa;
Product Name: Alumina Ceramic Substrate;
Thermal Conductivity: 25-30 W/Mk;
Purity: 95%-99%;
Type: Ceramic Plates;
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Application: Aerospace, Ceramic Decorations, Medical, Amb Substrate;
Compressive Strength: 2300MPa;
Coating Thickness: 8-30μm;
Coating Layer: Mo/Mn;
Plated Layer: Nickel/Copper/Gold;
Thermal Conductivity: 25W/(M.K);
Plating Thickness: 2-9μm;
Max. Use Temperature: 1600℃;
Density: 3.7g/cm3;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Insulating Ceramics;
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