| Specification |
Application: Electronic Devices, Semiconductors;
Material: BeO;
Thickness: Customized;
Hardness: 8~9;
Flexural Strength: 170~230 MPa;
Purity: 97%,99%;
Density: ≥2.85g/cm3;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Forming Methods: Tape Casting;
Purity of Material: 96%, 99.6% Alumina;
Color: White, Ivory, Pink, Black;
Min. Thickness: 0.15mm;
Max. Thickness: 20mm;
Secondary Process: Flat Grinding, Laser Cutting, CNC Machining;
Feature: High Mechanical Strength, High Insulation;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Forming Method: Tape Casting;
Feature: High Mechanical Strength, Small Dielectric Loss;
Optional Color: White, Ivory, Pink, Black;
Standard Thickness: 0.25-2.0mm Available;
Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness);
Length and Width Tolerance: ±2mm;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Ceramic Decorations, Refractory, Structure Ceramic;
Material: Aluminum Nitride Ceramic;
Process: Low-Temperature Co-fired Ceramic;
Color: White/Gray;
Category: Atomic Crystal;
Chemical Formula: Ain;
Boiling Point: 2249;
Weight: Customized;
OEM/ODM: Available;
Maximum Use Temperature: 2000c;
Thermal Conductivity: 170-186W/M'k;
Thermal Expansion Coefficient: 3.2X10-6c;
Lead Time: 10 Days;
Type: Ceramic Parts;
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Application: Ceramic Decorations, Refractory, Structure Ceramic;
Material: Aluminum Nitride Ceramic;
Process: Low-Temperature Co-fired Ceramic;
Color: White/Gray;
Category: Atomic Crystal;
Chemical Formula: Ain;
Boiling Point: 2249;
Weight: Customized;
OEM/ODM: Available;
Maximum Use Temperature: 2000c;
Thermal Conductivity: 170-186W/M'k;
Thermal Expansion Coefficient: 3.2X10-6c;
Lead Time: 10 Days;
Type: Ceramic Parts;
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