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Alumina Ceramic Substrate
US$1.00-10.00 / kg
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What is High Temperature Alumina Perforated Substrate For Burner Diffuser

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 kg US$1.00-10.00 / kg

Sepcifications

  • Application Electronic Devices, Semiconductors
  • Material Al2O3
  • Thickness Customized
  • Transport Package Carton and Pallet
  • Specification Customized
  • Trademark Adena Ceramic
  • Origin China
  • Color White
  • Density ≥3.70g/cm3
  • Max. Service Temperature 1200oC
  • Young's Modulus 340 Gpa

Product Description

Specification Ceramic substrate: 1. 96% Alumina (Al2O3) is one of the most popular ceramic substrate materials because of its excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. The surface of the Al2O3 plate is quite smooth and has a low porosity. 2. ...

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Alumina Ceramic Substrate Comparison
Transaction Info
Price US$1.00-10.00 / kg US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$0.20 / Piece US$1.00-15.00 / Piece
Min Order 10 kg 1 Piece 1 Piece 1,000 Pieces 1 Piece
Payment Terms LC, T/T, PayPal T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, Europe, East Asia(Japan/ South Korea), Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM - - ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month, 1-3 months
Off Season Lead Time: within 15 workdays, one month, 1-3 months		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Electronic Devices, Semiconductors;
Material: Al2O3;
Thickness: Customized;
Color: White;
Density: ≥3.70g/cm3;
Max. Service Temperature: 1200ºC;
Young's Modulus: 340 Gpa;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: Al2O3;
Process: Customizable;
Thickness: Customizable;
Density: 3.7g/Cm³;
Warp: ≤200um;
Wetability: ≥95%;
Flexural Strength: ≥330/350/700MPa;
Thermal Conductivity: 23W /M·K;
Dielectric Constant: 9 MHz;
Dielectric Strength: ≥20kv/mm;
Hole Diameter: 120~ 160um;
Hole Spacing: ≥0.2mm;
Positioning Accuracy: ±150um;
Hole to Metal Edge Distance: ≥0mm;
Hole to Tile Edge Distance: ≥1mm;
Main Ingredients: Cu AG Ti;
Application: /;
Conductive Layer: /;
Material: /;
Process: /;
Shape: Custom;
Advantage: Long Service Life;
Applicable Industries: Hotels, Garment Shops, Building Material Shops;
Feature: High Thermal Conductivity;
Application: Electronic Devices, Power Supply, Semiconductors;
Conductive Layer: Customizable;
Material: AlN;
Process: Customizable;
Thickness: Customizable;
Density: 3.3G/Cm³;
Warpage: ≤200um;
Solder Wettability: ≥95%;
Flexural Strength: ≥350MPa;
Thermal Conductivity: ≥170W/M K;
Coefficient of Thermal Expansion: 4.7(20~ 300℃)10-6/K;
Dielectric Loss: 0.0005MHz;
Dielectric Constant: 9MHz;
Dielectric Strength: ≥20kv/mm;
Resistivity: 10^14ω.Cm;
Aperture: 120-160μm;
Aperture Pitch: ≥0.2mm;
Au Layer Thickness: 0.01-0.2 μm;
Ni Layer Thickness: 2-10 μm;
AG Layer Thickness: 0.03-1.0 μm;
Supplier Name

Adena Ceramics International LLC (Shanghai)

Gold Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

TIANJIN YINGHUA NEW MATERIAL TECH CO., LTD.

Diamond Member Audited Supplier

Shenyang Vhandy Technology Co., Ltd

Diamond Member Audited Supplier

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