| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
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