| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
|
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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