| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Brand: Ca;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White;
Silksreen: Black;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4;
|
Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
|
