| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper, Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
MOQ: 1PCS;
Layer: 2 Layer;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Insulation Resin: Epoxy Resin;
Min. Hole Size: 1.0mm5%);
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Board Thickness: 1.6mm;
Surface Finishing: Double Sided Tin Spraying;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1.Cem-1,Cem-3,Fr-4halogenfree;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Color: Greenyellow, Black, White, Red, Blue;
Copper Thickness: 0.5oz1.0oz2oz3oz or Custom;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Supplier Type: Manufacturer;
Application: Consumer Electronics;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lead Free HASL, Imm Gold, OSP;
|
Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Smart;
Insulation Resin: Epoxy Resin;
Single Gross Weight: Kg;
Copper Thickness: Standard;
Min. Hole Size: 1.0mm5%);
Single Package Size: Xxcm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Min.Line Width: Standard;
Board Thickness: 1.6mm;
Surface Finishing: Double Sided Tin Spraying;
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