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High Power Aluminum 1.6mm 2oz OSP PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Square Meters US$65.00-90.00 / Square Meter

Sepcifications

  • Structure Metal Base Rigid PCB
  • Material Aluminium
  • Production Process Subtractive Process
  • Transport Package Vacuum Packing
  • Specification UL ISO TS16949 IPC
  • Trademark ZAPON
  • Origin China
  • Board Thickness 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
  • Thermal Conductivity 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
  • Ccl Brand Jh,Ccaf.etc
  • Sample Date 3-5days

Product Description

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float. It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, ...

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MCPCB Comparison
Transaction Info
Price US$65.00-90.00 / Square Meter US$0.10 / Piece US$0.10-6.00 / pcs US$0.01-20.00 / Piece US$0.10 / Piece
Min Order 5 Square Meters 1 Piece 1 pcs 1 Piece 1 Piece
Payment Terms LC, T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - RoHS, UL, SGS, Ect - - RoHS, UL, SGS, Ect
Management System Certification - - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr-4 Epoxy Glass Cloth;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: 94vo;
Brand: Abis;
Layers: 2;
Board Thick: 1.6mm;
Solder Mask: Green;
Silkscreen Color: White;
Surface Finish: Immersion Gold;
Copper Thickness: 35 Um/1oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Green;
Size: 35*45mm;
Package: Vacuum;
Supplier Name

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

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