| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP, Hal Lf;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ&Zapon;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Abis;
Layer Counts: 1-40 Layers;
Board Thickness: 0.20mm-8.00mm;
Maximum Size: 600mmx1200mm;
Board Outline Tolerance: +0.10mm;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Abis;
Layer: 1 Layer;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
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Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Polyimide;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED;
Mechanical Rigid: Fexible;
Material: Polyimide;
Brand: Abis;
Thermal Conductivity: 0.8-3W/M.K;
Board Thickness: 0.3-5mm;
Copper Thickness: 1-6oz;
Special Process: COB(Chip on Board/Direct Touch/Wire Bonding);
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Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Application: IP Camera Modlue;
Mechanical Rigid: Rigid;
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