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Elsky Fanless Android Mini PC with CPU Rockchip Rk3399 Realtek 8211f

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$120.00

100+ Pieces US$110.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 32G
  • Structure Mini-ITX
  • Memory 2g/4G
  • SATA Interface SATA3.0
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Transport Package Carton
  • Specification 146mm*100mm*12mm
  • Trademark Intel
  • Origin China
  • Warranty 1 Year
  • Certification CE
  • Fsb / Ht 4.0GHz

Product Description

Product Name: ELSKY fanless android mini pc with CPU Rockchip RK3399 Realtek 8211F Specifications: Company Information Shenzhen ELSKY Technology Co., Ltd. is one of the top designers and manufacturers of industrial computers in China. As a high-tech company, ELSKY has a wide range of ...

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Mini PC Comparison
Transaction Info
Price US$110.00-120.00 / Piece US$90.00-185.00 / Piece US$60.00-200.00 / Piece US$60.00-145.00 / Piece US$275.00-286.00 / Piece
Min Order 1 Piece 3 Pieces 5 Pieces 3 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification CE - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM - ODM, OEM -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
Memory: 2g/4G;
SATA Interface: SATA3.0;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Warranty: 1 Year;
Fsb / Ht: 4.0GHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1700;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Power Supply: DC 12V or 19V Voltage;
CPU Processor: Alder Lake 12th Generation Core I5;
Working Humidity: 5%~95% Relative Humidity;
Switch: 1*F_Panel Pin;1*Jatx Pin;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: 230*230mm;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Standard;
Printed Circuit Board: Six Layer;
Main Board Structure: CPU Based;
Audio Effects: Not HiFi;
Processor1: Intel® Alder Lake-N N97;
Processor2: Full Range of Intel® Alder Lake-N Cpus;
RAM: 1* DDR4 Slot, Max 32g;
Display: 1* VGA;
LAN: 6* Intel I210at Gigabit Ethernet Port;
Interface: 4*SATA,1*Msata;
Power Supply: DC_12V Single Power Input;
Expansion: 1* Mini-Pcie Slot,1*Pcie X1,2* M.2;
USB: 2*USB3.0,6*USB2.0;
Storage1: 1* SATA3.0,Transfer Speed up to 6gbps;
Storage2: 1* M.2 Slot(Support M.2 2280);
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1700;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Power Supply: DC 12V or 19V Voltage;
CPU Processor: Alder Lake 12th Generation Core I5;
Working Humidity: 5%~95% Relative Humidity;
Switch: 1*F_Panel Pin;1*Jatx Pin;
Integrated Graphics: Integrated Graphics;
Main Chipset: AMD;
Maximum Memory Capacity: 64G;
Structure: Nuc Motherboard;
Memory: DDR5;
SATA Interface: SATA3.0;
Main Board Structure: Integrated;
Processor System: AMD Ryzen 6000/7000 Series Processor on Board, Tdp;
RAM: 2*DDR5 So-DIMM, Total Max. 64GB;
Storage: 1*M.2 M-Key 2280(Nvme Pcie 4.0 X4 Protocol);
HDMI: 2*HDMI2.0 Interface, Support 4K@60Hz;
Type-C: 2*Type-C Interface;
LAN Port: 2*Rtl8125b Network;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Huaxing Technology Co., Ltd.

Gold Member Audited Supplier

R&O Industrial Technology Co., Limited

Gold Member Audited Supplier

Shenzhen Huaxing Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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