| Specification |
Type: Mat;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line, Hospital;
Color: Blue;
Thickness: 35micron;
Stickness: Low, Moderate, High, Super High;
Layers: 30layers, 60layers;
Condition: New;
Material: Low Density Polyethylene;
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Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.075mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.06mm, 0.07mm or 0.08mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.075mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.06mm, 0.07mm or 0.08mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.075mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.06mm, 0.07mm or 0.08mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.075mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.06mm, 0.07mm or 0.08mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
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