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Control Circuit Board for Mobile Phone

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.40-3.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Model FR-4
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark OEM
  • Origin China
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Surface Finishing Immersion Gold
  • Solder Mask Type Green
  • Silkscreen White
  • Min. Hole Size 0.25mm
  • Min. Line Width 0.15mm
  • Min. Line Spacing 0.15mm
  • Certificates UL, RoHS, SGS, ISO9001
  • Shipping DHL, UPS, TNT, FedEx, etc

Product Description

Control Circuit Board for Bluetooth Mobile Phone Base Information: 1. Board thickness: 1.6mm 2. Material: FR4 3. Surface Finishing: Immersion Gold 4. Soldermask: Green 5. Min. Hole Size: 0.25mm 6. Certificates: UL, RoHS, SGS, ISO9001 7. Shipping: DHL, UPS, TNT, FedEx, etc ++++++Our PCB ...

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PCB Comparison
Transaction Info
Price US$1.40-3.50 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification - - ISO /RoHS/ UL ISO 9001/14001 ISO/ RoHS/UL
Management System Certification - Others Others Others Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
PCB Type: Rigid;
PCB Layer: 2 Layer;
Outer Packing: Standard Carton Packing;
Inner Packing: Vacuum Packing;
PCB Thickness: 0.3-0.4mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Test: Aoi/Spi/X-ray;
PCB Material: Fr-4/Cem-1,Cem-3,Hight Tg;
PCB Type: Rigid;
PCB Shape: Any Shape;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Packing: Carton;
Delivery: 7-15 Days Sample;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Layer: 1-32 Layers;
Board Thickness: 0.3.-0.4mm;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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