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Printed Circuit Board
US$0.10 / Piece
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What is Prototype Multilayer PCB Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Metal Base Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJYPCB
  • Origin China
  • Surface Finishing Lf-Hal
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.25mm
  • Min. Line Wigth 0.1mm
  • Min. Line Spacing 0.1mm
  • Color White
  • Size 55*98
  • Certificate RoHS, UL, SGS, Ect
  • Package Vacuum

Product Description

Electronics control board Our PCB board manufacture and PCB assembly service: 1. PCB board file with parts list provided by customers 2. PCB board made, circuit board parts purchased by us 3. High Quality, competitive Price &Best Service 4.100% E-tested PCB Technical Capacity: Testing ...

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Printed Circuit Board Comparison
Transaction Info
Price US$0.10 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, UL, SGS, Ect - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
Color: White;
Size: 55*98;
Package: Vacuum;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Board Thickness: 1.0;
Mak: White Solder Mask;
PCB Material: Fr4, Alu;
Surface: Hal, Gold;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Min Component Size: 0201;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: 0.3mm;
Max.Precision of IC Assembly: +/-0.03mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: N/a;
Board Thickness: 2.0mm;
Mak: Green Solder Mask;
Surface: Hal-Lf;
Silk: White;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold 2u'';
Solder Mask: Black;
Outer Copper: 2oz;
Inner Copper: 1oz;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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