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Multilayers Mobile Phone PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-2.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Mobile Phone
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJY
  • Origin China
  • Surface Finishing Enig
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.3mm
  • Min.Line Wigth 0.20mm
  • Min. Line Spacing 0.3mm
  • Layer 2
  • Solder Mask Green
  • Legend Mask White
  • Certificate UL,SGS,RoHS,ISO 9001

Product Description

WELCOME TO XJYPCB------------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used ...

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PCB Board Comparison
Transaction Info
Price US$0.10-2.00 / Piece US$0.40-0.80 / PCS US$0.50-0.80 / PCS US$100.00 / Piece US$0.04-0.10 / PCS
Min Order 1 Piece 1 PCS 1 PCS 1 Piece 1 PCS
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification UL,SGS,RoHS,ISO 9001 - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Mobile Phone;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: Enig;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.3mm;
Min.Line Wigth: 0.20mm;
Min. Line Spacing: 0.3mm;
Layer: 2;
Solder Mask: Green;
Legend Mask: White;
Type: Flex-Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.0mm;
Copper Thickness: 2oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Flex-Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Surface Finihsing: Immersion Gold;
Board Thickness: 1.6mm;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 28;
Thickness: 2.983mm;
Finished Copper Thickness: All 1 Oz;
Surface Finish: Enig;
Trace: 0.1mm;
Size: 297.98mm*339.98mm;
Soldermask Color: Green;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class III;
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Surface Finihsing: Immersion Gold;
Board Thickness: 0.1mm;
Lead Time: 6-8 Working Days;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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