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Micro SD PCB in Shenzhen Factory

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.15 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Fr4
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJYPCB/OEM
  • Origin China
  • Copper Thickness 1oz
  • Surface Finishing OSP
  • Solder Mask Type Green
  • Silkscreen White
  • Layer 4 Layer
  • Min.Hole Size 0.2mm
  • Min. Line Width 0.12mm
  • Min. Line Spacing 0.12mm
  • Test E-Test
  • Package Vacuum Packing

Product Description

After Sales Service Welcome, Welcome, Welcome, Welcome to our website! ! XinJiaye is able to offer one stop 1 to 24 Layer PCB fabrication, PCB manufacturing, component sourcing, PCB Assembly, PCBA Test, Reverse engineering service; FPC fabrication, Aluminium base fabrication, High Frequency ...

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Micro SD PCB Comparison
Transaction Info
Price US$0.15 / Piece US$0.99 / Piece US$0.99 / Piece US$0.90-99.99 / PCS US$0.56-5.39 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 PCS 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fr4;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Layer: 4 Layer;
Min.Hole Size: 0.2mm;
Min. Line Width: 0.12mm;
Min. Line Spacing: 0.12mm;
Test: E-Test;
Package: Vacuum Packing;
Type: Rigid Circuit Board;
Dielectric: Megtron 6 High-Speed;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Type: Rigid Circuit Board;
Dielectric: RO4830;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Type: Rigid Circuit Board;
Dielectric: RF-10;
Material: Ceramic-Filled PTFE + Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Surface Finish: Immersion Gold;
Board Thickness: 0.3mm (Finished);
Layer Count: 2-Layer;
Solder Mask: No;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1PCS;
Soldermask: White, Black, Blue, Red Ect;
Silkcreen: White, Black, Blue, Red Ect;
File: PCB File;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

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