| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
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Structure: Single-Sided Rigid PCB;
Dielectric: Rcc;
Material: Aluminum Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Rcc;
Brand: Hjh;
Sheet Thickness: 0.6-2.0mm;
Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others;
Protective Film Color: Green;
Thermal Conductivity: 0.6~2.0W;
Aluminum Base Material: 1060 / 5052;
Tg (DSC): >130 Degree;
Breakdown Voltage: AC>/=5kv;
|
Structure: Single-Sided Rigid PCB;
Dielectric: Rcc;
Material: Aluminum Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Rcc;
Brand: Hjh;
Sheet Thickness: 0.6-2.0mm;
Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others;
Protective Film Color: Green;
Thermal Conductivity: 0.6~2.0W;
Aluminum Base Material: 1060 / 5052;
Tg (DSC): >130 Degree;
Breakdown Voltage: AC>/=5kv;
|
Structure: Single-Sided Rigid PCB;
Dielectric: Rcc;
Material: Aluminum Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Rcc;
Brand: Hjh;
Sheet Thickness: 0.6-2.0mm;
Copper Thickness: 15um, 18um, 25um, 35um, 70um, Others;
Protective Film Color: Green;
Thermal Conductivity: 0.6~2.0W;
Aluminum Base Material: 1060 / 5052;
Tg (DSC): >130 Degree;
Breakdown Voltage: AC>/=5kv;
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Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
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